Description
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)
Sale!
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Original price was: ₨ 2,000.₨ 1,500Current price is: ₨ 1,500.
Colour Matt Finished
Only logged in customers who have purchased this product may leave a review.
Related products
-
Sale!
Statistical Methods in Hydrology and Hydroclimatology 2nd Edition
Original price was: ₨ 2,500.₨ 2,000Current price is: ₨ 2,000. Add to cart Order Via Whatsapp -
Sale!
Viruses Bacteria and Fungi in the Built Environment Designing Healthy Indoor Environments
Original price was: ₨ 2,000.₨ 1,500Current price is: ₨ 1,500. Add to cart Order Via Whatsapp -
Sale!
Trends on Construction in the Digital Era Proceedings of ISIC 2022
Original price was: ₨ 3,000.₨ 2,300Current price is: ₨ 2,300. Add to cart Order Via Whatsapp -
Sale!
Sustainability and Health in Intelligent Buildings
Original price was: ₨ 2,000.₨ 1,400Current price is: ₨ 1,400. Add to cart Order Via Whatsapp
Reviews
There are no reviews yet.